Solder Paste for Printing and Dispensing
–Package: Jar / Syringe / Cartridge
–Flux: Non-Clean / Low Residue / Water-soluble
–Alloy: Sn / Ag / Cu / Sb / Bi / Pb / Au
–Powder Size: T3~T7
Solder Wire
–Package: Reel
–Flux: Pure metal / Flux contained 1~3%
–Alloy: Sn / Ag / Cu / Sb / Pb
Solder Preform
–Package: Bottle / Waffle / Tape and Reel
–Flux: Pure Alloy / Flux Coating
–Alloy: Sn / Ag / Cu / Sb / Bi / Pb / Au
–Shape: Circle / Square / Customize
Physical Based for Kits
Type: CO2 Based
–物理衝突(Physical Blasting): 通過 高壓空氣 將 “乾冰粒子” 高速噴射到清洗表面衝突熱衝突(Thermal Shock)當-78.5攝氏度的乾冰因昇華熱, 異物質收縮發生裂膨漲(Sublimation expansion)體積至800倍, 境界面破損剝離(Ablation)高速壓縮空氣使之引發剝離現象
Solder Ball
–Package: Bottle 1kk~5kk
–Alloy: Sn / Ag / Cu
–Type: Solder Ball / Cu Core Ball
–Ball Size: 180um ~ 450um
–Doping: Ni or Ge,
Flux for Die Bonding / Ball Mounting / Bumping
–Package: Syringe / Cartridge / Bottle
–Type: Low residue / Water-soluble
